Technical Parameters
| Kev sib xyaw | Cov ntsiab lus | CAS Nr. |
| Dej ntshiab | 85-90% | 7732-18-5 ib |
| Sodium benzoate hmoov | 0.1-0.2% | 532-32-1 : kuv |
| Surfactant | 4-5% | ∕ |
| Lwm tus | 4-5% | ∕ |
Khoom nta
1, Kev tiv thaiv ib puag ncig siab: Kev xaiv etching tuaj yeem ua tiav yam tsis tas siv cov hauv paus organic xws li TMAH.
2, Tus nqi qis qis: Siv NaOH / KOH ua cov kua etching, tus nqi qis dua cov kua qaub polishing thiab etching txheej txheem.
3, High etching efficiency: Piv nrog rau cov kua qaub polishing thiab etching txheej txheem, lub roj teeb efficiency yog nce los ntawm ntau tshaj 0.15%.
Cov khoom siv
1, Cov khoom no feem ntau haum rau Perc thiab Topcon roj teeb txheej txheem;
2, Tsim nyog rau ib qho crystals ntawm 210, 186, 166, thiab 158 specifications.
Cov lus qhia rau kev siv
1, Ntxiv qhov tsim nyog ntawm alkali rau hauv lub tank (1.5-4% raws li KOH / NAOH ntim piv)
2, Ntxiv qhov tsim nyog ntawm cov khoom no rau hauv lub tank (1.0-2% raws li qhov ntim piv)
3 、 Ua kom sov lub polishing tank kua rau 60-65 ° C
4 、 Muab cov silicon wafer nrog sab nraub qaum PSG tshem tawm mus rau hauv lub tank polishing, lub sijhawm tshuaj tiv thaiv yog 180s-250s
5, Pom zoo yuag poob ib sab: 0.24-0.30g (210 wafer qhov chaw, lwm qhov chaw yog hloov dua siab tshiab nyob rau hauv sib npaug proportions) ib leeg thiab polycrystalline PERC hnub ci hlwb
Cov kev ceev faj
1 、 Cov khoom ntxiv yuav tsum tau khaws cia nruj me ntsis ntawm lub teeb.
2, Thaum cov kab ntau lawm tsis tsim, cov kua dej yuav tsum tau ntxiv thiab ntws tawm txhua 30 feeb.Yog tias tsis muaj ntau tshaj 2 teev, nws raug nquahu kom ntws thiab rov ua cov kua dej.
3 、 Cov kab tshiab debugging yuav tsum DOE tsim raws li txhua tus txheej txheem ntawm cov kab ntau lawm kom ua tiav cov txheej txheem sib txuam, yog li ua kom muaj txiaj ntsig zoo.Cov txheej txheem pom zoo tuaj yeem raug xa mus rau kev debugging.
